STRUCTURE WITH AIR GAPS EXTENDING FROM DIELECTRIC LINER AROUND THROUGH SEMICONDCUTOR VIA

A structure includes a through semiconductor via (TSV) in a semiconductor substrate, and a dielectric liner surrounding the TSV and between the TSV and the semiconductor substrate. A plurality of discontinuous air gaps is in the semiconductor substrate extending away from the dielectric liner, e.g.,...

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Bibliographische Detailangaben

Hauptverfasser:	Xu, Dewei, Wu, Zhuojie, Smith, Daniel
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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