LOW POWER PLASMA SYSTEM MONITOR METHOD

This disclosure is a low power plasma system monitor method, which can be used to monitor the uniformity of the low power plasma system. A deposition process is performed on a testing substrate to form a metal film on the testing substrate. The resistance of the metal film on the testing substrate i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHANG, JUNG-HUA, LIN, JINGNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	This disclosure is a low power plasma system monitor method, which can be used to monitor the uniformity of the low power plasma system. A deposition process is performed on a testing substrate to form a metal film on the testing substrate. The resistance of the metal film on the testing substrate is measured to generate a plurality of first sheet resistance values. A testing pretreatment process is performed on the testing substrate through the low power plasma system to form a testing passivation on the metal film of the testing substrate. The resistance of the testing substrate after the testing pretreatment process is measured to generate a plurality of second sheet resistance values. Then the first sheet resistance values and the second sheet resistance values are analyzed to know the uniformity of the low power plasma system.