STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS

A microelectronic device package includes a stack of semiconductor dies positioned over a substrate. The microelectronic device package further includes an interposer structure coupled to the stack of semiconductor dies. The microelectronic device package further includes an electronic component dir...

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Hauptverfasser:	Leow, See Hiong, Pan, Ling, Boo, Kelvin Tan Aik, Ye, Seng Kim Dalson, Ng, Hong Wan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	Leow, See Hiong Pan, Ling Boo, Kelvin Tan Aik Ye, Seng Kim Dalson Ng, Hong Wan
description	A microelectronic device package includes a stack of semiconductor dies positioned over a substrate. The microelectronic device package further includes an interposer structure coupled to the stack of semiconductor dies. The microelectronic device package further includes an electronic component directly coupled to the interposer structure and electrically coupled to the substrate through an electrical connection between the interposer structure and the substrate.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND RELATED METHODS, DEVICES, AND SYSTEMS
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