SEMICONDUCTOR PACKAGES

A semiconductor package includes a first structure including a first semiconductor chip comprising a first semiconductor integrated circuit, and a second structure on the first structure. The second structure includes a second semiconductor chip including a second semiconductor integrated circuit, a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NA, Hoonjoo, KIM, Seokho, MOON, Kwangjin, KIM, Jinnam
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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