MODULE

A module includes a die pad arranged to locate a lower end thereof on a reference plane, a signal terminal arranged to locate a lower end thereof on the reference plane, an electronic component fixed as being superimposed above the die pad, and a sealing resin arranged to seal the die pad, the signal terminal, and the electronic component from above. The electronic component is provided with a component first surface facing a side of the die pad and a component second surface facing a side opposite to the die pad. The component second surface and the signal terminal are electrically connected to each other through a first wire. The die pad includes a die pad main body on which the electronic component is carried and a surrounding portion extending from the die pad main body along the reference plane to surround the signal terminal apart from the signal terminal.