PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES
An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The sec...
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| creator | Madhavapeddy, Seshagiri Rao Ganti, Suryaprakash |
| description | An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure. |
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The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FOR PERFORMING MECHANICAL WORK IN GENERAL ; GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL ; HEAT PUMP SYSTEMS ; HEATING ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY ; NON-POSITIVE DISPLACEMENT PUMPS ; PERFORMING OPERATIONS ; POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS ; PRINTED CIRCUITS ; PUMPS ; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS ; REFRIGERATION MACHINES, PLANTS OR SYSTEMS ; REFRIGERATION OR COOLING ; SEMICONDUCTOR DEVICES ; TELEPHONIC COMMUNICATION ; TRANSPORTING ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240711&DB=EPODOC&CC=US&NR=2024234247A9$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240711&DB=EPODOC&CC=US&NR=2024234247A9$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Madhavapeddy, Seshagiri Rao</creatorcontrib><creatorcontrib>Ganti, Suryaprakash</creatorcontrib><title>PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES</title><description>An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FOR PERFORMING MECHANICAL WORK IN GENERAL</subject><subject>GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MECHANICAL ENGINEERING</subject><subject>METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY</subject><subject>NON-POSITIVE DISPLACEMENT PUMPS</subject><subject>PERFORMING OPERATIONS</subject><subject>POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS</subject><subject>PRINTED CIRCUITS</subject><subject>PUMPS</subject><subject>PUMPS FOR LIQUIDS OR ELASTIC FLUIDS</subject><subject>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</subject><subject>REFRIGERATION OR COOLING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TELEPHONIC COMMUNICATION</subject><subject>TRANSPORTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEuDqK-w4FzQdKAOMbL1R40udCkHVxKkTiJFur7o4MP4PQP378uJDBdhVrC1DGCIxfLs4lkwWDigQBFWvYXqKWDhkwCyzFyMInFA_uvu9AnAksDI8VtsbpPjyXvft0U-5oSNmWeX2Ne5umWn_k99lEdlFaVVvpoTtV_1wf8KS-0</recordid><startdate>20240711</startdate><enddate>20240711</enddate><creator>Madhavapeddy, Seshagiri Rao</creator><creator>Ganti, Suryaprakash</creator><scope>EVB</scope></search><sort><creationdate>20240711</creationdate><title>PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES</title><author>Madhavapeddy, Seshagiri Rao ; Ganti, Suryaprakash</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024234247A93</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMBINED HEATING AND REFRIGERATION SYSTEMS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FOR PERFORMING MECHANICAL WORK IN GENERAL</topic><topic>GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL</topic><topic>HEAT PUMP SYSTEMS</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>LIQUEFACTION SOLIDIFICATION OF GASES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MANUFACTURE OR STORAGE OF ICE</topic><topic>MECHANICAL ENGINEERING</topic><topic>METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY</topic><topic>NON-POSITIVE DISPLACEMENT PUMPS</topic><topic>PERFORMING OPERATIONS</topic><topic>POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS</topic><topic>PRINTED CIRCUITS</topic><topic>PUMPS</topic><topic>PUMPS FOR LIQUIDS OR ELASTIC FLUIDS</topic><topic>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</topic><topic>REFRIGERATION OR COOLING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TELEPHONIC COMMUNICATION</topic><topic>TRANSPORTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>Madhavapeddy, Seshagiri Rao</creatorcontrib><creatorcontrib>Ganti, Suryaprakash</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Madhavapeddy, Seshagiri Rao</au><au>Ganti, Suryaprakash</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES</title><date>2024-07-11</date><risdate>2024</risdate><abstract>An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY NON-POSITIVE DISPLACEMENT PUMPS PERFORMING OPERATIONS POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PRINTED CIRCUITS PUMPS PUMPS FOR LIQUIDS OR ELASTIC FLUIDS REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING SEMICONDUCTOR DEVICES TELEPHONIC COMMUNICATION TRANSPORTING WEAPONS |
| title | PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES |
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