DEPOSITION APPARATUS
A deposition apparatus includes: a support module having a plurality of support parts coupled to a target substrate; a base substrate coupled to the support module; a connection member for connecting the plurality of support parts to the base substrate; and a mask assembly configured to mask a depos...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KANG, MINGOO RYU, SUKHA KO, JUNHYEUK SONG, MINCHUL KIM, EUIGYU CHO, YOUNGSUN |
| description | A deposition apparatus includes: a support module having a plurality of support parts coupled to a target substrate; a base substrate coupled to the support module; a connection member for connecting the plurality of support parts to the base substrate; and a mask assembly configured to mask a deposition material provided to the target substrate. The support module further includes position control parts, which control the plurality of support parts to be movable along a direction axis perpendicular to a major surface of each of the support parts, respectively. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024226955A9</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024226955A9</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024226955A93</originalsourceid><addsrcrecordid>eNrjZBBxcQ3wD_YM8fT3U3AMCHAMcgwJDeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRiZGRmaWpqaOlsbEqQIACoEf2A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DEPOSITION APPARATUS</title><source>esp@cenet</source><creator>KANG, MINGOO ; RYU, SUKHA ; KO, JUNHYEUK ; SONG, MINCHUL ; KIM, EUIGYU ; CHO, YOUNGSUN</creator><creatorcontrib>KANG, MINGOO ; RYU, SUKHA ; KO, JUNHYEUK ; SONG, MINCHUL ; KIM, EUIGYU ; CHO, YOUNGSUN</creatorcontrib><description>A deposition apparatus includes: a support module having a plurality of support parts coupled to a target substrate; a base substrate coupled to the support module; a connection member for connecting the plurality of support parts to the base substrate; and a mask assembly configured to mask a deposition material provided to the target substrate. The support module further includes position control parts, which control the plurality of support parts to be movable along a direction axis perpendicular to a major surface of each of the support parts, respectively.</description><language>eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240711&DB=EPODOC&CC=US&NR=2024226955A9$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240711&DB=EPODOC&CC=US&NR=2024226955A9$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANG, MINGOO</creatorcontrib><creatorcontrib>RYU, SUKHA</creatorcontrib><creatorcontrib>KO, JUNHYEUK</creatorcontrib><creatorcontrib>SONG, MINCHUL</creatorcontrib><creatorcontrib>KIM, EUIGYU</creatorcontrib><creatorcontrib>CHO, YOUNGSUN</creatorcontrib><title>DEPOSITION APPARATUS</title><description>A deposition apparatus includes: a support module having a plurality of support parts coupled to a target substrate; a base substrate coupled to the support module; a connection member for connecting the plurality of support parts to the base substrate; and a mask assembly configured to mask a deposition material provided to the target substrate. The support module further includes position control parts, which control the plurality of support parts to be movable along a direction axis perpendicular to a major surface of each of the support parts, respectively.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBxcQ3wD_YM8fT3U3AMCHAMcgwJDeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRiZGRmaWpqaOlsbEqQIACoEf2A</recordid><startdate>20240711</startdate><enddate>20240711</enddate><creator>KANG, MINGOO</creator><creator>RYU, SUKHA</creator><creator>KO, JUNHYEUK</creator><creator>SONG, MINCHUL</creator><creator>KIM, EUIGYU</creator><creator>CHO, YOUNGSUN</creator><scope>EVB</scope></search><sort><creationdate>20240711</creationdate><title>DEPOSITION APPARATUS</title><author>KANG, MINGOO ; RYU, SUKHA ; KO, JUNHYEUK ; SONG, MINCHUL ; KIM, EUIGYU ; CHO, YOUNGSUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024226955A93</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KANG, MINGOO</creatorcontrib><creatorcontrib>RYU, SUKHA</creatorcontrib><creatorcontrib>KO, JUNHYEUK</creatorcontrib><creatorcontrib>SONG, MINCHUL</creatorcontrib><creatorcontrib>KIM, EUIGYU</creatorcontrib><creatorcontrib>CHO, YOUNGSUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANG, MINGOO</au><au>RYU, SUKHA</au><au>KO, JUNHYEUK</au><au>SONG, MINCHUL</au><au>KIM, EUIGYU</au><au>CHO, YOUNGSUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEPOSITION APPARATUS</title><date>2024-07-11</date><risdate>2024</risdate><abstract>A deposition apparatus includes: a support module having a plurality of support parts coupled to a target substrate; a base substrate coupled to the support module; a connection member for connecting the plurality of support parts to the base substrate; and a mask assembly configured to mask a deposition material provided to the target substrate. The support module further includes position control parts, which control the plurality of support parts to be movable along a direction axis perpendicular to a major surface of each of the support parts, respectively.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2024226955A9 |
| source | esp@cenet |
| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | DEPOSITION APPARATUS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T19%3A33%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KANG,%20MINGOO&rft.date=2024-07-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024226955A9%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |