PACKAGE INCLUDING COMPOSITE INTERPOSER AND/OR COMPOSITE PACKAGING SUBSTRATE AND METHODS OF FORMING THE SAME

A chip package structure includes: a composite interposer including at least one in-interposer semiconductor chip including a respective semiconductor circuitry therein, a dielectric matrix laterally surrounding the at least one in-interposer semiconductor chip, a die-side redistribution structure l...

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Hauptverfasser:	CHEN, Ping Tai, WANG, Chin-Hua, LEE, Yu Chen, JENG, Shin-Puu, LEE, Tsung-Yen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	CHEN, Ping Tai WANG, Chin-Hua LEE, Yu Chen JENG, Shin-Puu LEE, Tsung-Yen
description	A chip package structure includes: a composite interposer including at least one in-interposer semiconductor chip including a respective semiconductor circuitry therein, a dielectric matrix laterally surrounding the at least one in-interposer semiconductor chip, a die-side redistribution structure located on a first side of the dielectric matrix, and a substrate-side redistribution structure located on a second side of the dielectric matrix; and at least one semiconductor die attached to the die-side redistribution structure through a respective array of solder material portions.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	PACKAGE INCLUDING COMPOSITE INTERPOSER AND/OR COMPOSITE PACKAGING SUBSTRATE AND METHODS OF FORMING THE SAME
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