LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

Provided are a laminate including an adhesive layer that can implement easy peeling when a semiconductor substrate and a support substrate are separated after processing of the semiconductor substrate and can suppress deformation of a bump, and the like.A laminate includes a semiconductor substrate...

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Bibliographische Detailangaben
Hauptverfasser:	OGATA, Hiroto, OKUNO, Takahisa, YAGYU, Masafumi
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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