ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES

ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES

Embodiments disclosed herein include electronic packages and methods of forming electronic packages. In an embodiment, the electronic package comprises a core, where the core comprises glass. In an embodiment, a through glass via (TGV) is provided through a thickness of the core, where a top surface...

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Bibliographische Detailangaben
Hauptverfasser: PIETAMBARAM, Srinivas V, TINGEY, Matthew L, ECTON, Jeremy D, FADAYOMI, Oladeji, CHEN, Shaojiang
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments disclosed herein include electronic packages and methods of forming electronic packages. In an embodiment, the electronic package comprises a core, where the core comprises glass. In an embodiment, a through glass via (TGV) is provided through a thickness of the core, where a top surface of the TGV is not coplanar with a top surface of the core. In an embodiment, the electronic package further comprises a ridge on the top surface of the TGV, where the ridge is symmetric about a centerline of the TGV.