ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY

Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed o...

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Hauptverfasser: LI, Eric J, LIFF, Shawna M, HEPPNER, Joshua D, FALCON, Javier A, YOSHIHIRO, Tomita
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LI, Eric J
LIFF, Shawna M
HEPPNER, Joshua D
FALCON, Javier A
YOSHIHIRO, Tomita
description Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024213171A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024213171A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024213171A13</originalsourceid><addsrcrecordid>eNrjZPAM9QkJclQI9nX08VHw9fdxcXUBUi6hPq4Knn4hru5BjiFAkXDPEA8FF09XBadIqKyuv59uuKOba5CCY3Cwq6-TTyQPA2taYk5xKi-U5mZQdnMNcfbQTS3Ij08tLkhMTs1LLYkPDTYyMDIxMjQ2NDd0NDQmThUAz2Mt0A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY</title><source>esp@cenet</source><creator>LI, Eric J ; LIFF, Shawna M ; HEPPNER, Joshua D ; FALCON, Javier A ; YOSHIHIRO, Tomita</creator><creatorcontrib>LI, Eric J ; LIFF, Shawna M ; HEPPNER, Joshua D ; FALCON, Javier A ; YOSHIHIRO, Tomita</creatorcontrib><description>Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240627&amp;DB=EPODOC&amp;CC=US&amp;NR=2024213171A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240627&amp;DB=EPODOC&amp;CC=US&amp;NR=2024213171A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI, Eric J</creatorcontrib><creatorcontrib>LIFF, Shawna M</creatorcontrib><creatorcontrib>HEPPNER, Joshua D</creatorcontrib><creatorcontrib>FALCON, Javier A</creatorcontrib><creatorcontrib>YOSHIHIRO, Tomita</creatorcontrib><title>ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY</title><description>Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAM9QkJclQI9nX08VHw9fdxcXUBUi6hPq4Knn4hru5BjiFAkXDPEA8FF09XBadIqKyuv59uuKOba5CCY3Cwq6-TTyQPA2taYk5xKi-U5mZQdnMNcfbQTS3Ij08tLkhMTs1LLYkPDTYyMDIxMjQ2NDd0NDQmThUAz2Mt0A</recordid><startdate>20240627</startdate><enddate>20240627</enddate><creator>LI, Eric J</creator><creator>LIFF, Shawna M</creator><creator>HEPPNER, Joshua D</creator><creator>FALCON, Javier A</creator><creator>YOSHIHIRO, Tomita</creator><scope>EVB</scope></search><sort><creationdate>20240627</creationdate><title>ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY</title><author>LI, Eric J ; LIFF, Shawna M ; HEPPNER, Joshua D ; FALCON, Javier A ; YOSHIHIRO, Tomita</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024213171A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LI, Eric J</creatorcontrib><creatorcontrib>LIFF, Shawna M</creatorcontrib><creatorcontrib>HEPPNER, Joshua D</creatorcontrib><creatorcontrib>FALCON, Javier A</creatorcontrib><creatorcontrib>YOSHIHIRO, Tomita</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI, Eric J</au><au>LIFF, Shawna M</au><au>HEPPNER, Joshua D</au><au>FALCON, Javier A</au><au>YOSHIHIRO, Tomita</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY</title><date>2024-06-27</date><risdate>2024</risdate><abstract>Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T15%3A13%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LI,%20Eric%20J&rft.date=2024-06-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024213171A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true