SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

A semiconductor package including a package substrate, a bridge structure stacked on the package substrate, a first molding member surrounding a side surface of the bridge structure, a trace pattern extending along an upper surface of the bridge structure and an upper surface of the first molding me...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JEON, Byeong Uk, YOU, Se-Ho
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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