METHOD AND APPARATUS FOR CLEANING SUBSTRATES USING HIGH TEMPERATURE CHEMICALS AND ULTRASONIC DEVICE
A method for cleaning substrates includes rotating a substrate; delivering deionized water on a surface of the substrate for pre wetting the surface of the substrate; delivering chemical solution with high temperature on the surface of the substrate for cleaning the surface of the substrate; changin...
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| creator | Jia, Shena Wang, Danying Chen, Fuping Wang, Hui Wang, Jian Jiang, Chaowei Wang, Xi Dai, Yingwei |
| description | A method for cleaning substrates includes rotating a substrate; delivering deionized water on a surface of the substrate for pre wetting the surface of the substrate; delivering chemical solution with high temperature on the surface of the substrate for cleaning the surface of the substrate; changing the rotation speed of the substrate to a low rotation speed, and moving a ultra/mega sonic device. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a first cleaning cycle; turning off the ultra/mega sonic device, and delivering a high temperature chemical solution or deionized water. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a second cleaning cycle; turning off the ultra/mega sonic device, and delivering rinse chemical solution or deionized water on the surface of the substrate; and drying the substrate. |
| format | Patent |
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The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a first cleaning cycle; turning off the ultra/mega sonic device, and delivering a high temperature chemical solution or deionized water. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a second cleaning cycle; turning off the ultra/mega sonic device, and delivering rinse chemical solution or deionized water on the surface of the substrate; and drying the substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS ; PREVENTION OF FOULING IN GENERAL ; PUMPS ; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS ; SEMICONDUCTOR DEVICES ; SEPARATION ; TRANSPORTING ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240627&DB=EPODOC&CC=US&NR=2024207760A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240627&DB=EPODOC&CC=US&NR=2024207760A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Jia, Shena</creatorcontrib><creatorcontrib>Wang, Danying</creatorcontrib><creatorcontrib>Chen, Fuping</creatorcontrib><creatorcontrib>Wang, Hui</creatorcontrib><creatorcontrib>Wang, Jian</creatorcontrib><creatorcontrib>Jiang, Chaowei</creatorcontrib><creatorcontrib>Wang, Xi</creatorcontrib><creatorcontrib>Dai, Yingwei</creatorcontrib><title>METHOD AND APPARATUS FOR CLEANING SUBSTRATES USING HIGH TEMPERATURE CHEMICALS AND ULTRASONIC DEVICE</title><description>A method for cleaning substrates includes rotating a substrate; delivering deionized water on a surface of the substrate for pre wetting the surface of the substrate; delivering chemical solution with high temperature on the surface of the substrate for cleaning the surface of the substrate; changing the rotation speed of the substrate to a low rotation speed, and moving a ultra/mega sonic device. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a first cleaning cycle; turning off the ultra/mega sonic device, and delivering a high temperature chemical solution or deionized water. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a second cleaning cycle; turning off the ultra/mega sonic device, and delivering rinse chemical solution or deionized water on the surface of the substrate; and drying the substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>PUMPS</subject><subject>PUMPS FOR LIQUIDS OR ELASTIC FLUIDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SEPARATION</subject><subject>TRANSPORTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwjAURbM4iPoPD5yFWMXOMX1tAm0S8hLXUkqcRAv1_zEVP8DhcuBwuGs2dhiUrUCYPOeEFyES1NaDbFEYbRqgeKWQPRJEWoTSjYKAncOl9ghSYaelaOl7E9tckzVaQoU3LXHLVvfhMafdjxu2rzFIdUjTq0_zNIzpmd59pIIX54KX5YWL4-m_6gPyzzU7</recordid><startdate>20240627</startdate><enddate>20240627</enddate><creator>Jia, Shena</creator><creator>Wang, Danying</creator><creator>Chen, Fuping</creator><creator>Wang, Hui</creator><creator>Wang, Jian</creator><creator>Jiang, Chaowei</creator><creator>Wang, Xi</creator><creator>Dai, Yingwei</creator><scope>EVB</scope></search><sort><creationdate>20240627</creationdate><title>METHOD AND APPARATUS FOR CLEANING SUBSTRATES USING HIGH TEMPERATURE CHEMICALS AND ULTRASONIC DEVICE</title><author>Jia, Shena ; Wang, Danying ; Chen, Fuping ; Wang, Hui ; Wang, Jian ; Jiang, Chaowei ; Wang, Xi ; Dai, Yingwei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024207760A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>PUMPS</topic><topic>PUMPS FOR LIQUIDS OR ELASTIC FLUIDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SEPARATION</topic><topic>TRANSPORTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>Jia, Shena</creatorcontrib><creatorcontrib>Wang, Danying</creatorcontrib><creatorcontrib>Chen, Fuping</creatorcontrib><creatorcontrib>Wang, Hui</creatorcontrib><creatorcontrib>Wang, Jian</creatorcontrib><creatorcontrib>Jiang, Chaowei</creatorcontrib><creatorcontrib>Wang, Xi</creatorcontrib><creatorcontrib>Dai, Yingwei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jia, Shena</au><au>Wang, Danying</au><au>Chen, Fuping</au><au>Wang, Hui</au><au>Wang, Jian</au><au>Jiang, Chaowei</au><au>Wang, Xi</au><au>Dai, Yingwei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD AND APPARATUS FOR CLEANING SUBSTRATES USING HIGH TEMPERATURE CHEMICALS AND ULTRASONIC DEVICE</title><date>2024-06-27</date><risdate>2024</risdate><abstract>A method for cleaning substrates includes rotating a substrate; delivering deionized water on a surface of the substrate for pre wetting the surface of the substrate; delivering chemical solution with high temperature on the surface of the substrate for cleaning the surface of the substrate; changing the rotation speed of the substrate to a low rotation speed, and moving a ultra/mega sonic device. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a first cleaning cycle; turning off the ultra/mega sonic device, and delivering a high temperature chemical solution or deionized water. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a second cleaning cycle; turning off the ultra/mega sonic device, and delivering rinse chemical solution or deionized water on the surface of the substrate; and drying the substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PREVENTION OF FOULING IN GENERAL PUMPS PUMPS FOR LIQUIDS OR ELASTIC FLUIDS SEMICONDUCTOR DEVICES SEPARATION TRANSPORTING WEAPONS |
| title | METHOD AND APPARATUS FOR CLEANING SUBSTRATES USING HIGH TEMPERATURE CHEMICALS AND ULTRASONIC DEVICE |
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