OPTICAL INSPECTION OF A WAFER

An image analysis device may align an image to determine a position of a wafer within the image. The wafer may include a plurality of wafer bumps. The image analysis device may mask, based on the position of the wafer, the image to obtain an image of a portion of the wafer. The image analysis device...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PAI, Jiun-Rong, HU, Cheng-Kang, WU, Cheng-Lung, CHEN, Chih-Lieh
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION TESTING
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