SEMICONDUCTOR PACKAGE

A semiconductor package includes a lower chip. A chip stacked structure is arranged on the lower chip. The chip stacked structure includes a plurality of upper chips. An underfill layer is disposed between the lower chip and the chip stacked structure and between the plurality of upper chips. A mold...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOI, Iljoo, HA, Sungmock, BAE, Jinsoo, NOH, Hyunggyun, BAE, Gunhee
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!