CIRCUIT DEVICE WITH MULTIPLE PARALLEL DATA PATHS
An integrated circuit (IC) includes first and second memory devices and a bridge. The IC also includes a first interconnect segment coupled between the first memory device and the bridge. The IC further includes a second interconnect segment coupled between the first and second memory devices, and a...
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creator | KARGUTH, Brian Jason VISALLI, Samuel Paul FUOCO, Charles Lance DENIO, Michael Anthony |
description | An integrated circuit (IC) includes first and second memory devices and a bridge. The IC also includes a first interconnect segment coupled between the first memory device and the bridge. The IC further includes a second interconnect segment coupled between the first and second memory devices, and a third interconnect segment coupled between the bridge and the second memory device. The IC includes a first DMA circuit coupled to the first interconnect segment, and a second DMA circuit coupled to the second interconnect segment. A fourth interconnect segment is coupled between the first and second DMA circuits. |
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A fourth interconnect segment is coupled between the first and second DMA circuits.</description><language>eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240613&DB=EPODOC&CC=US&NR=2024193112A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240613&DB=EPODOC&CC=US&NR=2024193112A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KARGUTH, Brian Jason</creatorcontrib><creatorcontrib>VISALLI, Samuel Paul</creatorcontrib><creatorcontrib>FUOCO, Charles Lance</creatorcontrib><creatorcontrib>DENIO, Michael Anthony</creatorcontrib><title>CIRCUIT DEVICE WITH MULTIPLE PARALLEL DATA PATHS</title><description>An integrated circuit (IC) includes first and second memory devices and a bridge. 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The IC also includes a first interconnect segment coupled between the first memory device and the bridge. The IC further includes a second interconnect segment coupled between the first and second memory devices, and a third interconnect segment coupled between the bridge and the second memory device. The IC includes a first DMA circuit coupled to the first interconnect segment, and a second DMA circuit coupled to the second interconnect segment. A fourth interconnect segment is coupled between the first and second DMA circuits.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng |
recordid | cdi_epo_espacenet_US2024193112A1 |
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subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS |
title | CIRCUIT DEVICE WITH MULTIPLE PARALLEL DATA PATHS |
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