CONDUCTIVE HOT MELT ADHESIVE, CONDUCTIVE INSULATING TAPE, AND BATTERY
Disclosed are a conductive hot melt adhesive, a conductive insulating tape, and a battery, where the conductive hot melt adhesive includes a matrix and a conductive filler. A Vicat softening temperature of the conductive hot melt adhesive ranges from 60° C. to 130° C., and the conductive hot melt ad...
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| creator | MO, Zhaohua LI, Suli HE, Fei LIN, Wenrong LI, Junyi HUANG, Wei |
| description | Disclosed are a conductive hot melt adhesive, a conductive insulating tape, and a battery, where the conductive hot melt adhesive includes a matrix and a conductive filler. A Vicat softening temperature of the conductive hot melt adhesive ranges from 60° C. to 130° C., and the conductive hot melt adhesive is solid in a first state and may soften and flow in a second state. The conductive hot melt adhesive is disposed between a positive electrode component and a negative electrode component of a battery. When a temperature is lower than the Vicat softening temperature of the conductive hot melt adhesive, the positive and negative electrode components cannot be conducted via the conductive hot melt adhesive; when the temperature is higher than the Vicat softening temperature, the conductive hot melt adhesive softens and flows, thereby conducting the positive and negative electrode components. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024186590A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024186590A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024186590A13</originalsourceid><addsrcrecordid>eNrjZHB19vdzCXUO8QxzVfDwD1HwdfUJUXB08XANBoroKCDJevoFh_o4hnj6uSuEOAYA5Rz9XBScHENCXIMieRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGRiaGFmamlgaOhMXGqACn9LOY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CONDUCTIVE HOT MELT ADHESIVE, CONDUCTIVE INSULATING TAPE, AND BATTERY</title><source>esp@cenet</source><creator>MO, Zhaohua ; LI, Suli ; HE, Fei ; LIN, Wenrong ; LI, Junyi ; HUANG, Wei</creator><creatorcontrib>MO, Zhaohua ; LI, Suli ; HE, Fei ; LIN, Wenrong ; LI, Junyi ; HUANG, Wei</creatorcontrib><description>Disclosed are a conductive hot melt adhesive, a conductive insulating tape, and a battery, where the conductive hot melt adhesive includes a matrix and a conductive filler. A Vicat softening temperature of the conductive hot melt adhesive ranges from 60° C. to 130° C., and the conductive hot melt adhesive is solid in a first state and may soften and flow in a second state. The conductive hot melt adhesive is disposed between a positive electrode component and a negative electrode component of a battery. When a temperature is lower than the Vicat softening temperature of the conductive hot melt adhesive, the positive and negative electrode components cannot be conducted via the conductive hot melt adhesive; when the temperature is higher than the Vicat softening temperature, the conductive hot melt adhesive softens and flows, thereby conducting the positive and negative electrode components.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240606&DB=EPODOC&CC=US&NR=2024186590A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240606&DB=EPODOC&CC=US&NR=2024186590A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MO, Zhaohua</creatorcontrib><creatorcontrib>LI, Suli</creatorcontrib><creatorcontrib>HE, Fei</creatorcontrib><creatorcontrib>LIN, Wenrong</creatorcontrib><creatorcontrib>LI, Junyi</creatorcontrib><creatorcontrib>HUANG, Wei</creatorcontrib><title>CONDUCTIVE HOT MELT ADHESIVE, CONDUCTIVE INSULATING TAPE, AND BATTERY</title><description>Disclosed are a conductive hot melt adhesive, a conductive insulating tape, and a battery, where the conductive hot melt adhesive includes a matrix and a conductive filler. A Vicat softening temperature of the conductive hot melt adhesive ranges from 60° C. to 130° C., and the conductive hot melt adhesive is solid in a first state and may soften and flow in a second state. The conductive hot melt adhesive is disposed between a positive electrode component and a negative electrode component of a battery. When a temperature is lower than the Vicat softening temperature of the conductive hot melt adhesive, the positive and negative electrode components cannot be conducted via the conductive hot melt adhesive; when the temperature is higher than the Vicat softening temperature, the conductive hot melt adhesive softens and flows, thereby conducting the positive and negative electrode components.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB19vdzCXUO8QxzVfDwD1HwdfUJUXB08XANBoroKCDJevoFh_o4hnj6uSuEOAYA5Rz9XBScHENCXIMieRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGRiaGFmamlgaOhMXGqACn9LOY</recordid><startdate>20240606</startdate><enddate>20240606</enddate><creator>MO, Zhaohua</creator><creator>LI, Suli</creator><creator>HE, Fei</creator><creator>LIN, Wenrong</creator><creator>LI, Junyi</creator><creator>HUANG, Wei</creator><scope>EVB</scope></search><sort><creationdate>20240606</creationdate><title>CONDUCTIVE HOT MELT ADHESIVE, CONDUCTIVE INSULATING TAPE, AND BATTERY</title><author>MO, Zhaohua ; LI, Suli ; HE, Fei ; LIN, Wenrong ; LI, Junyi ; HUANG, Wei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024186590A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>MO, Zhaohua</creatorcontrib><creatorcontrib>LI, Suli</creatorcontrib><creatorcontrib>HE, Fei</creatorcontrib><creatorcontrib>LIN, Wenrong</creatorcontrib><creatorcontrib>LI, Junyi</creatorcontrib><creatorcontrib>HUANG, Wei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MO, Zhaohua</au><au>LI, Suli</au><au>HE, Fei</au><au>LIN, Wenrong</au><au>LI, Junyi</au><au>HUANG, Wei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONDUCTIVE HOT MELT ADHESIVE, CONDUCTIVE INSULATING TAPE, AND BATTERY</title><date>2024-06-06</date><risdate>2024</risdate><abstract>Disclosed are a conductive hot melt adhesive, a conductive insulating tape, and a battery, where the conductive hot melt adhesive includes a matrix and a conductive filler. A Vicat softening temperature of the conductive hot melt adhesive ranges from 60° C. to 130° C., and the conductive hot melt adhesive is solid in a first state and may soften and flow in a second state. The conductive hot melt adhesive is disposed between a positive electrode component and a negative electrode component of a battery. When a temperature is lower than the Vicat softening temperature of the conductive hot melt adhesive, the positive and negative electrode components cannot be conducted via the conductive hot melt adhesive; when the temperature is higher than the Vicat softening temperature, the conductive hot melt adhesive softens and flows, thereby conducting the positive and negative electrode components.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY USE OF MATERIALS AS ADHESIVES |
| title | CONDUCTIVE HOT MELT ADHESIVE, CONDUCTIVE INSULATING TAPE, AND BATTERY |
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