PROXIMITY SENSOR
A packaged integrated circuit (IC), comprising: a lead frame; one or more semiconductor dies on the lead frame, the one or more semiconductor dies including a first circuit and a second circuit; and a molding compound encapsulating the lead frame and the semiconductor die, the molding compound inclu...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KODURI, Sreenivasan Kalyani STARK, Leslie Edward |
| description | A packaged integrated circuit (IC), comprising: a lead frame; one or more semiconductor dies on the lead frame, the one or more semiconductor dies including a first circuit and a second circuit; and a molding compound encapsulating the lead frame and the semiconductor die, the molding compound including a first cavity over the first circuit and a second cavity over the second circuit, in which at least one of the first or second cavities includes a second material different from the molding compound. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024178184A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024178184A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024178184A13</originalsourceid><addsrcrecordid>eNrjZBAICPKP8PT1DIlUCHb1C_YP4mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGJobmFoYWJo6GxsSpAgCXxR7E</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PROXIMITY SENSOR</title><source>esp@cenet</source><creator>KODURI, Sreenivasan Kalyani ; STARK, Leslie Edward</creator><creatorcontrib>KODURI, Sreenivasan Kalyani ; STARK, Leslie Edward</creatorcontrib><description>A packaged integrated circuit (IC), comprising: a lead frame; one or more semiconductor dies on the lead frame, the one or more semiconductor dies including a first circuit and a second circuit; and a molding compound encapsulating the lead frame and the semiconductor die, the molding compound including a first cavity over the first circuit and a second cavity over the second circuit, in which at least one of the first or second cavities includes a second material different from the molding compound.</description><language>eng</language><subject>ANALOGOUS ARRANGEMENTS USING OTHER WAVES ; BASIC ELECTRIC ELEMENTS ; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES ; MEASURING ; PHYSICS ; RADIO DIRECTION-FINDING ; RADIO NAVIGATION ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240530&DB=EPODOC&CC=US&NR=2024178184A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240530&DB=EPODOC&CC=US&NR=2024178184A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KODURI, Sreenivasan Kalyani</creatorcontrib><creatorcontrib>STARK, Leslie Edward</creatorcontrib><title>PROXIMITY SENSOR</title><description>A packaged integrated circuit (IC), comprising: a lead frame; one or more semiconductor dies on the lead frame, the one or more semiconductor dies including a first circuit and a second circuit; and a molding compound encapsulating the lead frame and the semiconductor die, the molding compound including a first cavity over the first circuit and a second cavity over the second circuit, in which at least one of the first or second cavities includes a second material different from the molding compound.</description><subject>ANALOGOUS ARRANGEMENTS USING OTHER WAVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>RADIO DIRECTION-FINDING</subject><subject>RADIO NAVIGATION</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAICPKP8PT1DIlUCHb1C_YP4mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGJobmFoYWJo6GxsSpAgCXxR7E</recordid><startdate>20240530</startdate><enddate>20240530</enddate><creator>KODURI, Sreenivasan Kalyani</creator><creator>STARK, Leslie Edward</creator><scope>EVB</scope></search><sort><creationdate>20240530</creationdate><title>PROXIMITY SENSOR</title><author>KODURI, Sreenivasan Kalyani ; STARK, Leslie Edward</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024178184A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>ANALOGOUS ARRANGEMENTS USING OTHER WAVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>RADIO DIRECTION-FINDING</topic><topic>RADIO NAVIGATION</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KODURI, Sreenivasan Kalyani</creatorcontrib><creatorcontrib>STARK, Leslie Edward</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KODURI, Sreenivasan Kalyani</au><au>STARK, Leslie Edward</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROXIMITY SENSOR</title><date>2024-05-30</date><risdate>2024</risdate><abstract>A packaged integrated circuit (IC), comprising: a lead frame; one or more semiconductor dies on the lead frame, the one or more semiconductor dies including a first circuit and a second circuit; and a molding compound encapsulating the lead frame and the semiconductor die, the molding compound including a first cavity over the first circuit and a second cavity over the second circuit, in which at least one of the first or second cavities includes a second material different from the molding compound.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2024178184A1 |
| source | esp@cenet |
| subjects | ANALOGOUS ARRANGEMENTS USING OTHER WAVES BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION SEMICONDUCTOR DEVICES TESTING |
| title | PROXIMITY SENSOR |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T01%3A40%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KODURI,%20Sreenivasan%20Kalyani&rft.date=2024-05-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024178184A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |