ENCAPSULATING RESIN COMPOSITION FOR INJECTION MOLDING

An encapsulating resin composition for injection molding of the present invention includes a thermosetting resin, a curing agent, an inorganic filler, and an imidazole catalyst, in which in a DSC curve obtained in a case where a temperature is raised from 30° C. to 330° C. by using a differential sc...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MOCHIZUKI, Shunsuke
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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