POWER AMPLIFIER DEVICE HAVING VERTICAL DIE INTERCONNECT STRUCTURE

A power amplifier device includes a transistor die with an elongated bondpad coupled to a terminal of an integrated transistor. The device also includes a substrate formed from a stack of alternating dielectric and patterned conductive layers. An elongated die contact is exposed at a first substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kim, Kevin, Shilimkar, Vikas, Schultz, Joseph Gerard
Format:	Patent
Sprache:	eng
Schlagworte:	AMPLIFIERS BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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