THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion direc...

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Hauptverfasser: Li, Pai Yuan, Yu, Da-Cyuan, Huang, Kuan-Yu, Huang, Sung-Hui, Lee, Hsiang-Fan
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Li, Pai Yuan
Yu, Da-Cyuan
Huang, Kuan-Yu
Huang, Sung-Hui
Lee, Hsiang-Fan
description A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
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