SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a first supply pipe supplying a first chemical liquid to a substrate, a second supply pipe, spaced apart from the first supply pipe, and supplying a second chemical liquid to the substrate, and a recovery pipe connected to the first supply pipe to collect th...
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creator | BAE, Hyun Woo LEE, Ju Hwan JUNG, Bu Young |
description | A substrate processing apparatus includes a first supply pipe supplying a first chemical liquid to a substrate, a second supply pipe, spaced apart from the first supply pipe, and supplying a second chemical liquid to the substrate, and a recovery pipe connected to the first supply pipe to collect the first chemical liquid, and disposed between the first supply pipe and the second supply pipe. |
format | Patent |
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APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; NOZZLES ; PERFORMING OPERATIONS ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240509&DB=EPODOC&CC=US&NR=2024149289A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240509&DB=EPODOC&CC=US&NR=2024149289A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BAE, Hyun Woo</creatorcontrib><creatorcontrib>LEE, Ju Hwan</creatorcontrib><creatorcontrib>JUNG, Bu Young</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS</title><description>A substrate processing apparatus includes a first supply pipe supplying a first chemical liquid to a substrate, a second supply pipe, spaced apart from the first supply pipe, and supplying a second chemical liquid to the substrate, and a recovery pipe connected to the first supply pipe to collect the first chemical liquid, and disposed between the first supply pipe and the second supply pipe.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>ATOMISING APPARATUS</subject><subject>NOZZLES</subject><subject>PERFORMING OPERATIONS</subject><subject>SPRAYING APPARATUS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDIxNDE0sjC0tHQ2PiVAEAYWwitg</recordid><startdate>20240509</startdate><enddate>20240509</enddate><creator>BAE, Hyun Woo</creator><creator>LEE, Ju Hwan</creator><creator>JUNG, Bu Young</creator><scope>EVB</scope></search><sort><creationdate>20240509</creationdate><title>SUBSTRATE PROCESSING APPARATUS</title><author>BAE, Hyun Woo ; LEE, Ju Hwan ; JUNG, Bu Young</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024149289A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>ATOMISING APPARATUS</topic><topic>NOZZLES</topic><topic>PERFORMING OPERATIONS</topic><topic>SPRAYING APPARATUS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>BAE, Hyun Woo</creatorcontrib><creatorcontrib>LEE, Ju Hwan</creatorcontrib><creatorcontrib>JUNG, Bu Young</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BAE, Hyun Woo</au><au>LEE, Ju Hwan</au><au>JUNG, Bu Young</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS</title><date>2024-05-09</date><risdate>2024</risdate><abstract>A substrate processing apparatus includes a first supply pipe supplying a first chemical liquid to a substrate, a second supply pipe, spaced apart from the first supply pipe, and supplying a second chemical liquid to the substrate, and a recovery pipe connected to the first supply pipe to collect the first chemical liquid, and disposed between the first supply pipe and the second supply pipe.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS NOZZLES PERFORMING OPERATIONS SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
title | SUBSTRATE PROCESSING APPARATUS |
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