COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECTROSTATIC DISCHARGE AND/OR ELECTROMAGNETIC INTERFERENCE

The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positione...

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Hauptverfasser: Pang, Mengzhi, Bhandari, Rishabh, Li, Jianjun, Sun, Yang, Navarrete, Rodrigo Rodriguez, Li, Yong guo, Krithivasan, Vijaykumar
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creator Pang, Mengzhi
Bhandari, Rishabh
Li, Jianjun
Sun, Yang
Navarrete, Rodrigo Rodriguez
Li, Yong guo
Krithivasan, Vijaykumar
description The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024145432A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024145432A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024145432A13</originalsourceid><addsrcrecordid>eNqNjE0KwjAUhLtxIeodHrgu2h8PEJJJG2gTSF4prkqRuBIt1I23t0IP4Go-mG9mm3ykcw0UhWtgtKmzaS80PPWGa2ohbCDtPHmoThpbEdcgaA3JgZwmNAt5F1iwkaRMkLXwFUhYdVpma92KyuInGMvwyz2sxD7Z3MfHHA9r7pKjBss6jdNriPM03uIzvocu5Oe8zMpLWeQiK_6zvq9eOyI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECTROSTATIC DISCHARGE AND/OR ELECTROMAGNETIC INTERFERENCE</title><source>esp@cenet</source><creator>Pang, Mengzhi ; Bhandari, Rishabh ; Li, Jianjun ; Sun, Yang ; Navarrete, Rodrigo Rodriguez ; Li, Yong guo ; Krithivasan, Vijaykumar</creator><creatorcontrib>Pang, Mengzhi ; Bhandari, Rishabh ; Li, Jianjun ; Sun, Yang ; Navarrete, Rodrigo Rodriguez ; Li, Yong guo ; Krithivasan, Vijaykumar</creatorcontrib><description>The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240502&amp;DB=EPODOC&amp;CC=US&amp;NR=2024145432A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240502&amp;DB=EPODOC&amp;CC=US&amp;NR=2024145432A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Pang, Mengzhi</creatorcontrib><creatorcontrib>Bhandari, Rishabh</creatorcontrib><creatorcontrib>Li, Jianjun</creatorcontrib><creatorcontrib>Sun, Yang</creatorcontrib><creatorcontrib>Navarrete, Rodrigo Rodriguez</creatorcontrib><creatorcontrib>Li, Yong guo</creatorcontrib><creatorcontrib>Krithivasan, Vijaykumar</creatorcontrib><title>COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECTROSTATIC DISCHARGE AND/OR ELECTROMAGNETIC INTERFERENCE</title><description>The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjE0KwjAUhLtxIeodHrgu2h8PEJJJG2gTSF4prkqRuBIt1I23t0IP4Go-mG9mm3ykcw0UhWtgtKmzaS80PPWGa2ohbCDtPHmoThpbEdcgaA3JgZwmNAt5F1iwkaRMkLXwFUhYdVpma92KyuInGMvwyz2sxD7Z3MfHHA9r7pKjBss6jdNriPM03uIzvocu5Oe8zMpLWeQiK_6zvq9eOyI</recordid><startdate>20240502</startdate><enddate>20240502</enddate><creator>Pang, Mengzhi</creator><creator>Bhandari, Rishabh</creator><creator>Li, Jianjun</creator><creator>Sun, Yang</creator><creator>Navarrete, Rodrigo Rodriguez</creator><creator>Li, Yong guo</creator><creator>Krithivasan, Vijaykumar</creator><scope>EVB</scope></search><sort><creationdate>20240502</creationdate><title>COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECTROSTATIC DISCHARGE AND/OR ELECTROMAGNETIC INTERFERENCE</title><author>Pang, Mengzhi ; Bhandari, Rishabh ; Li, Jianjun ; Sun, Yang ; Navarrete, Rodrigo Rodriguez ; Li, Yong guo ; Krithivasan, Vijaykumar</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024145432A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Pang, Mengzhi</creatorcontrib><creatorcontrib>Bhandari, Rishabh</creatorcontrib><creatorcontrib>Li, Jianjun</creatorcontrib><creatorcontrib>Sun, Yang</creatorcontrib><creatorcontrib>Navarrete, Rodrigo Rodriguez</creatorcontrib><creatorcontrib>Li, Yong guo</creatorcontrib><creatorcontrib>Krithivasan, Vijaykumar</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Pang, Mengzhi</au><au>Bhandari, Rishabh</au><au>Li, Jianjun</au><au>Sun, Yang</au><au>Navarrete, Rodrigo Rodriguez</au><au>Li, Yong guo</au><au>Krithivasan, Vijaykumar</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECTROSTATIC DISCHARGE AND/OR ELECTROMAGNETIC INTERFERENCE</title><date>2024-05-02</date><risdate>2024</risdate><abstract>The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECTROSTATIC DISCHARGE AND/OR ELECTROMAGNETIC INTERFERENCE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T01%3A27%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Pang,%20Mengzhi&rft.date=2024-05-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024145432A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true