MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND PIEZOELECTRIC COMPOSITE STACK THEREOF

A micro-electro-mechanical system (MEMS) device includes a substrate having a cavity and a MEMS structure disposed over the cavity and attached to the substrate. The MEMS structure includes at least one first piezoelectric layer having a first piezoelectric coefficient and two second piezoelectric l...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YELEHANKA, RAMACHANDRAMURTHY PRADEEP, XIA, JIA JIE, NAGARAJAN, RANGANATHAN, KALLUPALATHINKAL CHANDRAN, BEVITA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YELEHANKA, RAMACHANDRAMURTHY PRADEEP
XIA, JIA JIE
NAGARAJAN, RANGANATHAN
KALLUPALATHINKAL CHANDRAN, BEVITA
description A micro-electro-mechanical system (MEMS) device includes a substrate having a cavity and a MEMS structure disposed over the cavity and attached to the substrate. The MEMS structure includes at least one first piezoelectric layer having a first piezoelectric coefficient and two second piezoelectric layers respectively disposed under and above the first piezoelectric layer, where each second piezoelectric layer has a second piezoelectric coefficient higher than the first piezoelectric coefficient. The MEMS structure further includes a first electrode layer and a second electrode layer sandwiching the two second piezoelectric layers.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024136994A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024136994A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024136994A13</originalsourceid><addsrcrecordid>eNrjZAjw9XQO8td19XF1DgHSvq7OHo5-ns6OPgrBkcEhrr4KLq5hns6uCo5-LgoBnq5R_hCVns4Kzv6-Af7BniGuCsEhjs7eCiEerkGu_m48DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-NNjIwMjE0NjM0tLE0dCYOFUARJUwMg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND PIEZOELECTRIC COMPOSITE STACK THEREOF</title><source>esp@cenet</source><creator>YELEHANKA, RAMACHANDRAMURTHY PRADEEP ; XIA, JIA JIE ; NAGARAJAN, RANGANATHAN ; KALLUPALATHINKAL CHANDRAN, BEVITA</creator><creatorcontrib>YELEHANKA, RAMACHANDRAMURTHY PRADEEP ; XIA, JIA JIE ; NAGARAJAN, RANGANATHAN ; KALLUPALATHINKAL CHANDRAN, BEVITA</creatorcontrib><description>A micro-electro-mechanical system (MEMS) device includes a substrate having a cavity and a MEMS structure disposed over the cavity and attached to the substrate. The MEMS structure includes at least one first piezoelectric layer having a first piezoelectric coefficient and two second piezoelectric layers respectively disposed under and above the first piezoelectric layer, where each second piezoelectric layer has a second piezoelectric coefficient higher than the first piezoelectric coefficient. The MEMS structure further includes a first electrode layer and a second electrode layer sandwiching the two second piezoelectric layers.</description><language>eng</language><subject>BASIC ELECTRONIC CIRCUITRY ; DEAF-AID SETS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PUBLIC ADDRESS SYSTEMS ; RESONATORS ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240425&amp;DB=EPODOC&amp;CC=US&amp;NR=2024136994A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240425&amp;DB=EPODOC&amp;CC=US&amp;NR=2024136994A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YELEHANKA, RAMACHANDRAMURTHY PRADEEP</creatorcontrib><creatorcontrib>XIA, JIA JIE</creatorcontrib><creatorcontrib>NAGARAJAN, RANGANATHAN</creatorcontrib><creatorcontrib>KALLUPALATHINKAL CHANDRAN, BEVITA</creatorcontrib><title>MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND PIEZOELECTRIC COMPOSITE STACK THEREOF</title><description>A micro-electro-mechanical system (MEMS) device includes a substrate having a cavity and a MEMS structure disposed over the cavity and attached to the substrate. The MEMS structure includes at least one first piezoelectric layer having a first piezoelectric coefficient and two second piezoelectric layers respectively disposed under and above the first piezoelectric layer, where each second piezoelectric layer has a second piezoelectric coefficient higher than the first piezoelectric coefficient. The MEMS structure further includes a first electrode layer and a second electrode layer sandwiching the two second piezoelectric layers.</description><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>DEAF-AID SETS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</subject><subject>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PUBLIC ADDRESS SYSTEMS</subject><subject>RESONATORS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAjw9XQO8td19XF1DgHSvq7OHo5-ns6OPgrBkcEhrr4KLq5hns6uCo5-LgoBnq5R_hCVns4Kzv6-Af7BniGuCsEhjs7eCiEerkGu_m48DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-NNjIwMjE0NjM0tLE0dCYOFUARJUwMg</recordid><startdate>20240425</startdate><enddate>20240425</enddate><creator>YELEHANKA, RAMACHANDRAMURTHY PRADEEP</creator><creator>XIA, JIA JIE</creator><creator>NAGARAJAN, RANGANATHAN</creator><creator>KALLUPALATHINKAL CHANDRAN, BEVITA</creator><scope>EVB</scope></search><sort><creationdate>20240425</creationdate><title>MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND PIEZOELECTRIC COMPOSITE STACK THEREOF</title><author>YELEHANKA, RAMACHANDRAMURTHY PRADEEP ; XIA, JIA JIE ; NAGARAJAN, RANGANATHAN ; KALLUPALATHINKAL CHANDRAN, BEVITA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024136994A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>DEAF-AID SETS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</topic><topic>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PUBLIC ADDRESS SYSTEMS</topic><topic>RESONATORS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YELEHANKA, RAMACHANDRAMURTHY PRADEEP</creatorcontrib><creatorcontrib>XIA, JIA JIE</creatorcontrib><creatorcontrib>NAGARAJAN, RANGANATHAN</creatorcontrib><creatorcontrib>KALLUPALATHINKAL CHANDRAN, BEVITA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YELEHANKA, RAMACHANDRAMURTHY PRADEEP</au><au>XIA, JIA JIE</au><au>NAGARAJAN, RANGANATHAN</au><au>KALLUPALATHINKAL CHANDRAN, BEVITA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND PIEZOELECTRIC COMPOSITE STACK THEREOF</title><date>2024-04-25</date><risdate>2024</risdate><abstract>A micro-electro-mechanical system (MEMS) device includes a substrate having a cavity and a MEMS structure disposed over the cavity and attached to the substrate. The MEMS structure includes at least one first piezoelectric layer having a first piezoelectric coefficient and two second piezoelectric layers respectively disposed under and above the first piezoelectric layer, where each second piezoelectric layer has a second piezoelectric coefficient higher than the first piezoelectric coefficient. The MEMS structure further includes a first electrode layer and a second electrode layer sandwiching the two second piezoelectric layers.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2024136994A1
source esp@cenet
subjects BASIC ELECTRONIC CIRCUITRY
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PUBLIC ADDRESS SYSTEMS
RESONATORS
TRANSPORTING
title MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND PIEZOELECTRIC COMPOSITE STACK THEREOF
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-30T20%3A49%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YELEHANKA,%20RAMACHANDRAMURTHY%20PRADEEP&rft.date=2024-04-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024136994A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true