DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The...

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Hauptverfasser:	BECKER, Wiren Dale, HEJASE, Jose A, PHAM, Nam Huu, PREDA, Francesco, ROY PALADHI, Pavel, CHUN, Sungjun, DREPS, Daniel Mark, TANG, Junyan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	BECKER, Wiren Dale HEJASE, Jose A PHAM, Nam Huu PREDA, Francesco ROY PALADHI, Pavel CHUN, Sungjun DREPS, Daniel Mark TANG, Junyan
description	An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated LGA contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
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