INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTOR APPARATUS

An interconnect substrate includes an insulating layer, an electrode disposed on the insulating layer and having a first surface not covered with the insulating layer, and an external connection terminal disposed on the first surface of the electrode, wherein the electrode has a recess in the first...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AIZAWA, Mitsuhiro, MURAYAMA, Kei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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