METHODS AND APPARATUS FOR COOLING A SUBSTRATE SUPPORT

Methods and apparatus for processing a substrate are provided herein. For example, an apparatus for processing a substrate comprises a process chamber configured to process a substrate, a substrate support comprising a heat sink configured to cool the substrate support during operation and a water t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KINTNER, Shane Lawrence, DECOTTIGNIES, Robert Irwin, FISH, Roger Bradford, SZUDARSKI, Steven
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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