COMPUTING DEVICES WITH IMPROVED THERMAL MANAGEMENT

Devices, apparatuses, systems, and methods are provided for improved thermal management in networking computing devices. An example thermal management apparatus includes a housing defining a first end and a second end opposite the first end. The apparatus further includes an electronic component sup...

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Hauptverfasser:	Ruso, Ran Hasson, Mentovich, Elad, Cader, Tahir, Narasimhan, Susheela
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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creator	Ruso, Ran Hasson Mentovich, Elad Cader, Tahir Narasimhan, Susheela
description	Devices, apparatuses, systems, and methods are provided for improved thermal management in networking computing devices. An example thermal management apparatus includes a housing defining a first end and a second end opposite the first end. The apparatus further includes an electronic component supported within the housing, such as a GPU. The apparatus includes a primary inlet that receives a primary airflow having a first temperature and a secondary inlet that receives a secondary airflow having a second temperature where the second temperature is different than the first temperature. The primary airflow and the secondary airflow are collectively configured to dissipate heat generated by the electronic component.
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subjects	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
title	COMPUTING DEVICES WITH IMPROVED THERMAL MANAGEMENT
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