SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

A semiconductor package includes a first semiconductor chip and a second semiconductor chip on the first semiconductor chip. The first semiconductor chip includes a first wiring layer on a first substrate, and a first passivation layer on the first wiring layer and that exposes at least portions of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Seo, Sunkyoung, Kim, Hyoeun, Kim, Dohyun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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