POWER MODULE PACKAGE HAVING MIRRORED LEADS

In one general aspect, an apparatus can include a semiconductor die, a molding material disposed around at least a portion of the semiconductor die, and a pair of leads electrically coupled to the semiconductor die and aligned along a first direction from the molding material. The molding material c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BILARDO, Paolo, TEYSSEYRE, Jerome, LEE, Keunhyuk, IM, Seungwon, PARK, Jeonghyuk
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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