ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANSDUCER

An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Alie, Susan A, Rothberg, Jonathan M, Zahorian, Jaime Scott, Fife, Keith G, Cristman, Paul Francis
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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