CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure...

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Hauptverfasser:	HUANG, Cheng-Lin, CHU, Che-Jung, LI, Ling-Wei, WU, Yu-Jui, CHEN, Lieh-Chuan, LI, Chien-Chen, YANG, Sheng-Yao, LIU, Kuo-Chio
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	HUANG, Cheng-Lin CHU, Che-Jung LI, Ling-Wei WU, Yu-Jui CHEN, Lieh-Chuan LI, Chien-Chen YANG, Sheng-Yao LIU, Kuo-Chio
description	A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.
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title	CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
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