SEMICONDUCTOR PACKAGE

A semiconductor package includes a first semiconductor chip stacked on a second semiconductor chip. The first semiconductor chip includes a first substrate, a first insulating layer on a lower surface of the first substrate, and a first pad exposed through the first insulating layer. The second semi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, YEONGSEON, SEO, SUNKYOUNG, KIM, JUHYEON, JO, CHAJEA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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