PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRING PATTERN FORMING METHOD
The present disclosure relates to a photosensitive resin film containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a polymerization inhibitor and having a thickness of 35 to 300 μm.
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| creator | ARAI, Tatsuhiko NARITA, Mao FUKAYA, Takahiro ONO, Keishi HIRAYAMA, Fuuka |
| description | The present disclosure relates to a photosensitive resin film containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a polymerization inhibitor and having a thickness of 35 to 300 μm. |
| format | Patent |
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| language | eng |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRING PATTERN FORMING METHOD |
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