PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRING PATTERN FORMING METHOD

PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRING PATTERN FORMING METHOD

The present disclosure relates to a photosensitive resin film containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a polymerization inhibitor and having a thickness of 35 to 300 μm.

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Bibliographische Detailangaben
Hauptverfasser: ARAI, Tatsuhiko, NARITA, Mao, FUKAYA, Takahiro, ONO, Keishi, HIRAYAMA, Fuuka
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Beschreibung
Zusammenfassung:The present disclosure relates to a photosensitive resin film containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a polymerization inhibitor and having a thickness of 35 to 300 μm.