LIQUID EJECTION HEAD AND RECORDING APPARATUS
There is used a liquid ejection head that includes: a base substrate including a flow passage of liquid formed therein; chips disposed on the base substrate and configured to eject the liquid; and a cover member disposed on the base substrate so as to surround the chips, and in which a sealing resin...
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| creator | KIDO, TAKAHITO |
| description | There is used a liquid ejection head that includes: a base substrate including a flow passage of liquid formed therein; chips disposed on the base substrate and configured to eject the liquid; and a cover member disposed on the base substrate so as to surround the chips, and in which a sealing resin is applied to gaps between a plurality of the chips and the cover member, a distance of the gaps between the chips and the cover member is non-uniform, and the gaps are each provided with a protrusion. |
| format | Patent |
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i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; PERFORMING OPERATIONS ; PRINTING ; SELECTIVE PRINTING MECHANISMS ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240404&DB=EPODOC&CC=US&NR=2024109323A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240404&DB=EPODOC&CC=US&NR=2024109323A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIDO, TAKAHITO</creatorcontrib><title>LIQUID EJECTION HEAD AND RECORDING APPARATUS</title><description>There is used a liquid ejection head that includes: a base substrate including a flow passage of liquid formed therein; chips disposed on the base substrate and configured to eject the liquid; and a cover member disposed on the base substrate so as to surround the chips, and in which a sealing resin is applied to gaps between a plurality of the chips and the cover member, a distance of the gaps between the chips and the cover member is non-uniform, and the gaps are each provided with a protrusion.</description><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINING MACHINES</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTING</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDx8QwM9XRRcPVydQ7x9PdT8HB1dFFw9HNRCHJ19g9y8fRzV3AMCHAMcgwJDeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRiaGBpbGRsaOhsbEqQIAFjYl5w</recordid><startdate>20240404</startdate><enddate>20240404</enddate><creator>KIDO, TAKAHITO</creator><scope>EVB</scope></search><sort><creationdate>20240404</creationdate><title>LIQUID EJECTION HEAD AND RECORDING APPARATUS</title><author>KIDO, TAKAHITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024109323A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINING MACHINES</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTING</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIDO, TAKAHITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIDO, TAKAHITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LIQUID EJECTION HEAD AND RECORDING APPARATUS</title><date>2024-04-04</date><risdate>2024</risdate><abstract>There is used a liquid ejection head that includes: a base substrate including a flow passage of liquid formed therein; chips disposed on the base substrate and configured to eject the liquid; and a cover member disposed on the base substrate so as to surround the chips, and in which a sealing resin is applied to gaps between a plurality of the chips and the cover member, a distance of the gaps between the chips and the cover member is non-uniform, and the gaps are each provided with a protrusion.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS |
| title | LIQUID EJECTION HEAD AND RECORDING APPARATUS |
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