ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD
An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and...
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| creator | KIM, Dohoon LEE, Hyeongju YUN, Hyelim PARK, Jinyong KIM, Taewoo BANG, Jungje MIN, Bongkyu |
| description | An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024107726A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024107726A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024107726A13</originalsourceid><addsrcrecordid>eNqNyzELwjAQhuEsDqL-hwNnoY1i53o59cAm5ZJ0LUXSSbRQ_z-2IM5OH3y8z1L1dCMM4iwjGGoYCdBVtbBnewG2gaR2ngR8FHHRmvlGFowcYLIV2eDBsJ8rA87CZCdlftHJlWLWatF3jzFtvrtS2zMFvO7S8GrTOHT39EzvNnqd6UOeFYU-lvn-v-oD6ho2lg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD</title><source>esp@cenet</source><creator>KIM, Dohoon ; LEE, Hyeongju ; YUN, Hyelim ; PARK, Jinyong ; KIM, Taewoo ; BANG, Jungje ; MIN, Bongkyu</creator><creatorcontrib>KIM, Dohoon ; LEE, Hyeongju ; YUN, Hyelim ; PARK, Jinyong ; KIM, Taewoo ; BANG, Jungje ; MIN, Bongkyu</creatorcontrib><description>An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240328&DB=EPODOC&CC=US&NR=2024107726A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240328&DB=EPODOC&CC=US&NR=2024107726A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, Dohoon</creatorcontrib><creatorcontrib>LEE, Hyeongju</creatorcontrib><creatorcontrib>YUN, Hyelim</creatorcontrib><creatorcontrib>PARK, Jinyong</creatorcontrib><creatorcontrib>KIM, Taewoo</creatorcontrib><creatorcontrib>BANG, Jungje</creatorcontrib><creatorcontrib>MIN, Bongkyu</creatorcontrib><title>ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD</title><description>An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyzELwjAQhuEsDqL-hwNnoY1i53o59cAm5ZJ0LUXSSbRQ_z-2IM5OH3y8z1L1dCMM4iwjGGoYCdBVtbBnewG2gaR2ngR8FHHRmvlGFowcYLIV2eDBsJ8rA87CZCdlftHJlWLWatF3jzFtvrtS2zMFvO7S8GrTOHT39EzvNnqd6UOeFYU-lvn-v-oD6ho2lg</recordid><startdate>20240328</startdate><enddate>20240328</enddate><creator>KIM, Dohoon</creator><creator>LEE, Hyeongju</creator><creator>YUN, Hyelim</creator><creator>PARK, Jinyong</creator><creator>KIM, Taewoo</creator><creator>BANG, Jungje</creator><creator>MIN, Bongkyu</creator><scope>EVB</scope></search><sort><creationdate>20240328</creationdate><title>ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD</title><author>KIM, Dohoon ; LEE, Hyeongju ; YUN, Hyelim ; PARK, Jinyong ; KIM, Taewoo ; BANG, Jungje ; MIN, Bongkyu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024107726A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, Dohoon</creatorcontrib><creatorcontrib>LEE, Hyeongju</creatorcontrib><creatorcontrib>YUN, Hyelim</creatorcontrib><creatorcontrib>PARK, Jinyong</creatorcontrib><creatorcontrib>KIM, Taewoo</creatorcontrib><creatorcontrib>BANG, Jungje</creatorcontrib><creatorcontrib>MIN, Bongkyu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, Dohoon</au><au>LEE, Hyeongju</au><au>YUN, Hyelim</au><au>PARK, Jinyong</au><au>KIM, Taewoo</au><au>BANG, Jungje</au><au>MIN, Bongkyu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD</title><date>2024-03-28</date><risdate>2024</risdate><abstract>An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD |
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