DEVICE WAFER PROCESSING METHOD
A device wafer processing method includes a protective film forming step of forming a protective film that covers a face side of a device wafer, a mask forming step of, after the protective film forming step is carried out, applying a laser beam along streets and forming, in the protective film, a m...
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| creator | WAKAHARA, Masatoshi |
| description | A device wafer processing method includes a protective film forming step of forming a protective film that covers a face side of a device wafer, a mask forming step of, after the protective film forming step is carried out, applying a laser beam along streets and forming, in the protective film, a mask that has grooves extending along the streets, a device layer plasma etching step of, after the mask forming step is carried out, performing plasma etching on a device layer of the device wafer by device layer gas through the mask, and a base member plasma etching step of, after the device layer plasma etching step is carried out, performing plasma etching on the base member by base member gas through the mask. |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | DEVICE WAFER PROCESSING METHOD |
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