SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME

A substrate loading device includes an electrostatic chuck that chucks a substrate, a mask frame disposed under the electrostatic chuck, and including an edge having a flat top surface, and a plurality of holders disposed between the electrostatic chuck and the mask frame. Each of the plurality of holders includes a first connection part connected to a side of the electrostatic chuck, a second connection part connected to the first connection part and extending in a direction intersecting an extension direction of the first connection part, and a third connection part connected to the second connection part, extending in a direction intersecting an extension direction of the second connection part, and rotationally moving between a first position overlapping the substrate in a thickness direction of the substrate and a second position spaced apart from the substrate.