POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

A power semiconductor package includes: a die carrier having first and second opposite sides; and first and second power semiconductor dies each having first and second power electrodes on opposite sides. The second power electrodes face and are electrically coupled to the first side of the carrier....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tommy Khoo, Chwee Pang, Unterhofer, Katrin, Schiele, Christian, Uredat, Patrick, Otremba, Ralf, Gan, Thai Kee, Lee, Teck Sim
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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