ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

An electronic package is provided, in which a mesh structure is disposed between a circuit structure and an electronic element to increase the shunt path of current. Therefore, when the electronic element is used as an electrode pad of a power contact, the current can be passed through a conductive...

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Hauptverfasser: CHUANG, Min-Han, LIN, Ho-Chuan, LAI, Chia-Chu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHUANG, Min-Han
LIN, Ho-Chuan
LAI, Chia-Chu
description An electronic package is provided, in which a mesh structure is disposed between a circuit structure and an electronic element to increase the shunt path of current. Therefore, when the electronic element is used as an electrode pad of a power contact, the current can be passed through a conductive sheet of the circuit structure via the mesh structure, such that the power loss can be reduced and the IR drop of the electronic element can meet the requirements.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024079301A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024079301A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024079301A13</originalsourceid><addsrcrecordid>eNrjZDB29XF1Dgny9_N0VghwdPZ2dHdVcPRzUfB19At1c3QOCQ3y9HNX8HUN8fB3UQjxcA1y9XfjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkYmBuaWxgaGjobGxKkCADHkJ-8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</title><source>esp@cenet</source><creator>CHUANG, Min-Han ; LIN, Ho-Chuan ; LAI, Chia-Chu</creator><creatorcontrib>CHUANG, Min-Han ; LIN, Ho-Chuan ; LAI, Chia-Chu</creatorcontrib><description>An electronic package is provided, in which a mesh structure is disposed between a circuit structure and an electronic element to increase the shunt path of current. Therefore, when the electronic element is used as an electrode pad of a power contact, the current can be passed through a conductive sheet of the circuit structure via the mesh structure, such that the power loss can be reduced and the IR drop of the electronic element can meet the requirements.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240307&amp;DB=EPODOC&amp;CC=US&amp;NR=2024079301A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240307&amp;DB=EPODOC&amp;CC=US&amp;NR=2024079301A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHUANG, Min-Han</creatorcontrib><creatorcontrib>LIN, Ho-Chuan</creatorcontrib><creatorcontrib>LAI, Chia-Chu</creatorcontrib><title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</title><description>An electronic package is provided, in which a mesh structure is disposed between a circuit structure and an electronic element to increase the shunt path of current. Therefore, when the electronic element is used as an electrode pad of a power contact, the current can be passed through a conductive sheet of the circuit structure via the mesh structure, such that the power loss can be reduced and the IR drop of the electronic element can meet the requirements.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB29XF1Dgny9_N0VghwdPZ2dHdVcPRzUfB19At1c3QOCQ3y9HNX8HUN8fB3UQjxcA1y9XfjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkYmBuaWxgaGjobGxKkCADHkJ-8</recordid><startdate>20240307</startdate><enddate>20240307</enddate><creator>CHUANG, Min-Han</creator><creator>LIN, Ho-Chuan</creator><creator>LAI, Chia-Chu</creator><scope>EVB</scope></search><sort><creationdate>20240307</creationdate><title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</title><author>CHUANG, Min-Han ; LIN, Ho-Chuan ; LAI, Chia-Chu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024079301A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHUANG, Min-Han</creatorcontrib><creatorcontrib>LIN, Ho-Chuan</creatorcontrib><creatorcontrib>LAI, Chia-Chu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHUANG, Min-Han</au><au>LIN, Ho-Chuan</au><au>LAI, Chia-Chu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</title><date>2024-03-07</date><risdate>2024</risdate><abstract>An electronic package is provided, in which a mesh structure is disposed between a circuit structure and an electronic element to increase the shunt path of current. Therefore, when the electronic element is used as an electrode pad of a power contact, the current can be passed through a conductive sheet of the circuit structure via the mesh structure, such that the power loss can be reduced and the IR drop of the electronic element can meet the requirements.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T04%3A29%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHUANG,%20Min-Han&rft.date=2024-03-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024079301A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true