BUILT-IN TEMPERATURE SENSORS

The present disclosure relates to semiconductor structures and, more particularly, to built-in temperature sensors and methods of manufacture and operation. The structure includes: a semiconductor on insulator substrate; an insulator layer under the semiconductor on the insulator substrate; a handle...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN, Yiching, ZHAO, Zhixing
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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