PERPENDICULAR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS

A semiconductor device assembly can include an assembly semiconductor die having a top surface with a first and a second assembly communication element thereat. The semiconductor device assembly can further include a semiconductor die stack coupled to the top surface. The die stack can include a fir...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hsu, Bang-Ning, Bayless, Andrew M, Wirz, Brandon P, Fay, Owen R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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