SEMICONDUCTOR PACKAGE

A semiconductor package includes a package substrate, an interposer substrate on the package substrate, first connection bumps between the package substrate and the interposer substrate, first and second semiconductor chips on the interposer substrate, second connection bumps between the interposer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Choi, Hwanyoung, Lee, Seokhyun, Jung, Yanggyoo, Ahn, Seok Geun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!