REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE

The present disclosure provides methods and structures to prevent cracks in redistribution layers. A redistribution structure according to the present disclosure includes a first polymer layer disposed over a silicon substrate, a first contact via disposed in the first polymer layer, a second polyme...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chuang, Yao-Chun, Yang, Tien-Chung, Kuo, Ting-Ting, Huang, Li-Hsien, He, Jun, Lu, Yinlung
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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