WORKPIECE PROCESSING METHOD

WORKPIECE PROCESSING METHOD

Pressing a protective member causes the protective member to be embedded in boundaries of adjacent ones of a plurality of devices serving as recesses on a front surface side of a substrate, and the protective member is ground so that the front surface side of the protective member is planarized. Thi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FUJII, Yusuke, MATSUZAWA, Minoru, TSUJIMOTO, Kohei
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator FUJII, Yusuke
MATSUZAWA, Minoru
TSUJIMOTO, Kohei
description Pressing a protective member causes the protective member to be embedded in boundaries of adjacent ones of a plurality of devices serving as recesses on a front surface side of a substrate, and the protective member is ground so that the front surface side of the protective member is planarized. This makes it possible to eliminate a gap between the substrate and the protective member or to reduce this gap in size, while making it possible to eliminate a gap between a chuck table holding the substrate through the protective member and the protective member or reduce this gap in size. Hence, by carrying out these steps prior to grinding of the back surface side of the substrate, it is possible to prevent the back surface side of the substrate from becoming uneven, in association with grinding of the back surface side of the substrate.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024058922A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024058922A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024058922A13</originalsourceid><addsrcrecordid>eNrjZJAO9w_yDvB0dXZVCAjyd3YNDvb0c1fwdQ3x8HfhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkYmBqYWlkZGjobGxKkCAOZ-IaE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WORKPIECE PROCESSING METHOD</title><source>esp@cenet</source><creator>FUJII, Yusuke ; MATSUZAWA, Minoru ; TSUJIMOTO, Kohei</creator><creatorcontrib>FUJII, Yusuke ; MATSUZAWA, Minoru ; TSUJIMOTO, Kohei</creatorcontrib><description>Pressing a protective member causes the protective member to be embedded in boundaries of adjacent ones of a plurality of devices serving as recesses on a front surface side of a substrate, and the protective member is ground so that the front surface side of the protective member is planarized. This makes it possible to eliminate a gap between the substrate and the protective member or to reduce this gap in size, while making it possible to eliminate a gap between a chuck table holding the substrate through the protective member and the protective member or reduce this gap in size. Hence, by carrying out these steps prior to grinding of the back surface side of the substrate, it is possible to prevent the back surface side of the substrate from becoming uneven, in association with grinding of the back surface side of the substrate.</description><language>eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240222&amp;DB=EPODOC&amp;CC=US&amp;NR=2024058922A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240222&amp;DB=EPODOC&amp;CC=US&amp;NR=2024058922A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJII, Yusuke</creatorcontrib><creatorcontrib>MATSUZAWA, Minoru</creatorcontrib><creatorcontrib>TSUJIMOTO, Kohei</creatorcontrib><title>WORKPIECE PROCESSING METHOD</title><description>Pressing a protective member causes the protective member to be embedded in boundaries of adjacent ones of a plurality of devices serving as recesses on a front surface side of a substrate, and the protective member is ground so that the front surface side of the protective member is planarized. This makes it possible to eliminate a gap between the substrate and the protective member or to reduce this gap in size, while making it possible to eliminate a gap between a chuck table holding the substrate through the protective member and the protective member or reduce this gap in size. Hence, by carrying out these steps prior to grinding of the back surface side of the substrate, it is possible to prevent the back surface side of the substrate from becoming uneven, in association with grinding of the back surface side of the substrate.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAO9w_yDvB0dXZVCAjyd3YNDvb0c1fwdQ3x8HfhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkYmBqYWlkZGjobGxKkCAOZ-IaE</recordid><startdate>20240222</startdate><enddate>20240222</enddate><creator>FUJII, Yusuke</creator><creator>MATSUZAWA, Minoru</creator><creator>TSUJIMOTO, Kohei</creator><scope>EVB</scope></search><sort><creationdate>20240222</creationdate><title>WORKPIECE PROCESSING METHOD</title><author>FUJII, Yusuke ; MATSUZAWA, Minoru ; TSUJIMOTO, Kohei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024058922A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJII, Yusuke</creatorcontrib><creatorcontrib>MATSUZAWA, Minoru</creatorcontrib><creatorcontrib>TSUJIMOTO, Kohei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJII, Yusuke</au><au>MATSUZAWA, Minoru</au><au>TSUJIMOTO, Kohei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WORKPIECE PROCESSING METHOD</title><date>2024-02-22</date><risdate>2024</risdate><abstract>Pressing a protective member causes the protective member to be embedded in boundaries of adjacent ones of a plurality of devices serving as recesses on a front surface side of a substrate, and the protective member is ground so that the front surface side of the protective member is planarized. This makes it possible to eliminate a gap between the substrate and the protective member or to reduce this gap in size, while making it possible to eliminate a gap between a chuck table holding the substrate through the protective member and the protective member or reduce this gap in size. Hence, by carrying out these steps prior to grinding of the back surface side of the substrate, it is possible to prevent the back surface side of the substrate from becoming uneven, in association with grinding of the back surface side of the substrate.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2024058922A1
source esp@cenet
subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title WORKPIECE PROCESSING METHOD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T18%3A41%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FUJII,%20Yusuke&rft.date=2024-02-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024058922A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true