SEMICONDUCTOR PACKAGE

A semiconductor package includes: a redistribution layer including a plurality of redistribution patterns; a sub-semiconductor package including a sub-semiconductor package substrate and a first semiconductor chip that is on the sub-semiconductor package substrate, wherein the sub-semiconductor pack...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Park, Jinwoo, YIM, Choongbin, Park, Gitae
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!