INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME

In a method of manufacturing an integrated fan-out (InFO) package, access openings are formed passing through a dielectric layer covering an interface redistribution layer (RDL) to expose electrical contacts of the interface RDL, or within which electrical contacts of the interface RDL are formed. T...

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Bibliographische Detailangaben

Hauptverfasser:	Chuang, Yao-Chun, Yang, Tien-Chung, Kuo, Ting-Ting, Huang, Li-Hsien, Lu, Yinlung
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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