STRESS AND WARPAGE IMPROVEMENTS FOR STIFFENER RING PACKAGE WITH EXPOSED DIE(S)

A package, and method for building the package is disclosed. The package includes a substrate having a first surface. The package further includes a die having opposing first and second surfaces, and a lateral surface, with the second surface of the die coupled to the first surface of the substrate....

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Zhao, Sam Ziqun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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