MINIMIZING SUBSTRATE BOW DURING POLISHING

Exemplary polishing methods for chemical mechanical polishing may include engaging a substrate with a membrane of a substrate carrier. The methods may include chucking the substrate against a substantially planar surface defined by the substrate carrier. The chucking may reduce a bow in the substrat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Oh, Jeonghoon, Lee, Christopher HeungGyun, Lau, Eric L, Zhang, Huanbo, Mikhaylichenko, Ekaterina A, Zhu, Zhize
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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